IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Wire bonding, a foundational process in microelectronics, is essential to establishing a robust and low-resistance electrical connection between semiconductor chips and their respective packages or, ...

New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...

The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways.

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

SANTA CLARA, Calif. — Chip-packaging giant Advanced Semiconductor Engineering Inc. (ASE) today unveiled a new wire bonding technique that reduces the die size but increases I/O for complex chips.

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, ...

Taiwan's OSATs, now sustaining full capacity utilization for wire-bonding process for lower-end logic chips, are embracing strong backend demand for diverse HPC chips, but their actual business ...

Leadframe supplier Chang Wah Technology (CWTC) has seen clear order visibility through April 2022, in line with wire-bonding process capacity at backend houses already booked by chipmakers through ...