In addition, the company offers five-axis CNC polishing, five-axis force-controlled polishing, five-axis stack polishing, wet polishing, new energy tray grinding line, 3D glass hole polishing, ...
Abstract: The thinning of sapphire wafers is a key process that affects the quality of optoelectronic devices. In the grinding process for sapphire, a hard and brittle material, the grade and surface ...
Abstract: With a relatively high gear ratio and consequently a long magnetic path in the Vernier reluctance machine, its yoke is always thicker than that of conventional PMSM machines, which ...
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